Presentation Titles and Abstracts

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VITA 93 QMC Small Form Factor Mezzanine Modules

The new VITA 93 standard specifies a new high-performance mezzanine module and carrier card interface. Designed for small form factors, the QMC mezzanine aims to bring performance of XMC modules to a tiny package enabling users to mix and match I/O functions on VPX, VNX+, and other platforms.

Flexible/Reversible VITA 62 Modular Power

The presentation will address the flexibility possible with VITA 62 power supply designs. It will highlight recent demonstrations where, of necessity, a high power VPX supply was run backwards to serve as a regenerative load and provide power back to the input. The presentation will also discuss other possible non-standard uses of the design to allow systems to offer other functions without the long draw-out design from scratch process.

OpenVPX Transforming Space Operations

With a mature ecosystem that spans more than 40 years, OpenVPX has long been a formidable open standard for military and rugged industrial environments.  This reliable architecture has also helped space-rated systems incorporate more advanced technologies, like Artificial Intelligence (AI).  AI’s high-performance data processing, coupled with the inherent rugged properties of OpenVPX, is fostering an increasing number of space missions across many industry sectors.

This session will provide a look at the growing reliance on open standards to enable space applications, specifically examining command & data handling systems, earth observation satellites, and inter-constellation networking. It also explores next steps for this open standard in future deep space and lunar missions for commercial and military applications.

Faster. Stronger. More: Fiber Optics and High-Speed Solutions for Tomorrow’s VITA Ecosystem

In an era defined by an insatiable demand for speed, capacity, and durability, VITA standards are at the forefront of embedded systems evolution. In our presentation, “Faster. Stronger. More: Fiber Optics and High-Speed Solutions for Tomorrow’s VITA Ecosystem,” we delve into the cutting-edge advancements in optical and high-speed connectivity solutions. By exploring the path from chassis wall to PCB, we highlight the critical role of high-density fiber technologies—such as VITA 66.5 optical interconnects, MT ferrules, and hot-swappable transceivers—in addressing the rising need for reliability, higher throughput, and reduced mean-time-to-repair (MTTR). 

Exceeding Expectations Using Intel® Processors 

The Digital Engineering (R)evolution: Model-Based Engineering (MBE) and Next-Generation Rugged Embedded Systems Design 

Bringing the “App Store” to Embedded Computing Systems

As the SOSA™ Technical Standard is solidifying hardware architectures, it is evolving significantly in terms of defining rules for the software architectures. The SOSA Reference Architecture, Edition 2.0, Version 2 defines rules and a set of profiles for the software Run-Time Environment (RTE) that a SOSA module must operate within. These RTE profiles define constraints and dictate the interfaces that application developers must adhere to in order to create highly portable SOSA modules.

The SOSA standard also defines key software elements that are required in a SOSA aligned Systems. These are the System Manager and Task Manager which standardize the management of the health, operation and configuration of the platform and its security. They also facilitate the coordination of all mission operations. Together, the system and task management functions defined in sections 5 and 6 of the SOSA standard, along with the specific module functions defined in sections 8 through 11, specify over 250 software interactions.

When these software elements are brought together, they take a major step towards a “app store” of SOSA modules, enabling for example, a tracking module to be replaced by a different one from another developer with no code changes.

Whilst defining these functions are essential for insuring SOSA module portability and interoperability, the scope creates a significant headache and overhead for the developers of these modules, who really want to focus on the core of the application and not the management framework and abstraction layers.

This provides the opportunity for the development of toolkits and reference implementations to reduce these pain points by providing core building blocks that can save hundreds of software development hours.

Unlocking OEM Potential by Mastering Legacy Support 

Original Equipment Manufacturers (OEMs) often face significant challenges when it comes to sustaining legacy designs, including resource misallocation, rising operational costs, and unseen organizational inefficiencies. While the priority often remains on new product development, neglecting legacy sustainment can drain critical resources, delay innovation, and erode profitability.

This presentation explores how OEMs can unlock hidden potential within their organizations by gaining visibility into the true costs and liabilities of legacy support. It addresses key challenges such as short-term focus, underestimating obsolescence costs, and inefficient processes, while offering actionable strategies for improvement. By identifying gaps in current resource usage and implementing formal obsolescence management plans, OEMs can reclaim operational efficiency and redirect focus toward growth and innovation.

Real-world case studies highlight the risks of managing legacy support in-house and demonstrate the benefits of adopting strategic, long-term approaches. Ultimately, this presentation provides a framework for OEMs to achieve sustainable growth, retain customer trust, and solidify market leadership by mastering the complexities of legacy product support.

Next Generation VITA100.0 Secure Management for Mission Critical Processing Systems

The revolutionary VITA 100.0 standard will enable the integration of more complex subsystems than VITA 65.0. These complex systems will require capable system management solutions to properly and securely maintain them and deliver features equivalent to those found in commercial processing systems. VITA 100.2 strives to fulfill the user need to manage their VITA 100.0 solutions. Learn about the objectives, planned capabilities, and key features of VITA 100.2 including security management and why its important for mission critical processing. 

Unlocking Multi-Function Aperture Sensors for Next-Generation Defense Systems 

Advancements in multi-function aperture (MFA) sensors are transforming defense systems by enabling adaptive, reconfigurable sensor processing algorithms and seamless multi-modal data integration within a highly SWaP-optimized framework. Despite the potential, these technologies pose new challenges from traditional sensor processor architectures, requiring hardware resource allocation and reconfiguration, efficient movement of large amounts of sensor data, and a strategy to qualify new algorithms as they become available. This presentation will explore these obstacles and what is needed from an architecture and open standards perspective to unlock the full potential of multi-function apertures for next-generation sensor processing applications.

A New Era in High-Speed Data Transmission

High-Performance, Small Form Factor Open Standard SoMs

System on Modules (SoMs) constantly require increased performance in smaller form factors (SFF). Applications using SFF SoMs run the gamut from UxVs, gaming and medical to transportation, IoT, and other embedded computing applications. SFF SoMs have historically used x86 system architectures, but emerging platforms leverage ARM®, RISC-V, FPGA, SoC FPGA, GPU, and other compute engines.

As SFF SoMs increase in performance, pin-count and density, SoM designers are challenged to define component placement, PCB layout, pinout, and interconnect options for digital, analog, RF, power, and control signals. Additionally, routing I/O expansion protocols on SoMs and SoM carrier cards enable rapid prototyping and system emulation.

Several new and on-going SFF SoM open standards efforts are simplifying system design while addressing the need for next-gen performance. In this presentation, Samtec technical experts will update the latest SFF SoM open-standards efforts including UxV / 35™, VITA 93, SGeT HFM™ and PICMG® COM-HPC®

A Giant Leap for Interconnect: Next Gen VITA 100

With advances in silicon packages, there is a need to accommodate increased power consumption, higher pin counts and higher data rates while maintaining a smaller footprint. These requirements will be a challenge when implementing OpenVPX in next generation systems. In this presentation, we will discuss advances in interconnect for tomorrow’s embedded systems and preview the next generation connector – with increased pin count, data rates, and capacity – selected for VITA 100 architecture.