Presentation Titles and Abstracts

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VITA 93 QMC Small Form Factor Mezzanine Modules

The new VITA 93 standard specifies a new high-performance mezzanine module and carrier card interface. Designed for small form factors, the QMC mezzanine aims to bring performance of XMC modules to a tiny package enabling users to mix and match I/O functions on VPX, VNX+, and other platforms.

Rugged High Reliability Solutions for Small System Applications

The presentation will address the challenges in selecting rugged high reliability connectors that can meet the needs of today's military systems. It will address the many factors that are critically important for these systems. Environmental performance, signal integrity and density, power handling capability and other details will be discussed. 

Faster. Stronger. More: Fiber Optics and High-Speed Solutions for Tomorrow’s VITA Ecosystem

In an era defined by an insatiable demand for speed, capacity, and durability, VITA standards are at the forefront of embedded systems evolution. In our presentation, “Faster. Stronger. More: Fiber Optics and High-Speed Solutions for Tomorrow’s VITA Ecosystem,” we delve into the cutting-edge advancements in optical and high-speed connectivity solutions. By exploring the path from chassis wall to PCB, we highlight the critical role of high-density fiber technologies—such as VITA 66.5 optical interconnects, MT ferrules, and hot-swappable transceivers—in addressing the rising need for reliability, higher throughput, and reduced mean-time-to-repair (MTTR). 

The Digital Engineering (R)evolution: Model-Based Engineering (MBE) and Next-Generation Rugged Embedded Systems Design 

Next Generation VITA100.0 Secure Management for Mission Critical Processing Systems

The revolutionary VITA 100.0 standard will enable the integration of more complex subsystems than VITA 65.0. These complex systems will require capable system management solutions to properly and securely maintain them and deliver features equivalent to those found in commercial processing systems. VITA 100.2 strives to fulfill the user need to manage their VITA 100.0 solutions. Learn about the objectives, planned capabilities, and key features of VITA 100.2 including security management and why its important for mission critical processing. 

High-Performance, Small Form Factor Open Standard SoMs

System on Modules (SoMs) constantly require increased performance in smaller form factors (SFF). Applications using SFF SoMs run the gamut from UxVs, gaming and medical to transportation, IoT, and other embedded computing applications. SFF SoMs have historically used x86 system architectures, but emerging platforms leverage ARM®, RISC-V, FPGA, SoC FPGA, GPU, and other compute engines.

As SFF SoMs increase in performance, pin-count and density, SoM designers are challenged to define component placement, PCB layout, pinout, and interconnect options for digital, analog, RF, power, and control signals. Additionally, routing I/O expansion protocols on SoMs and SoM carrier cards enable rapid prototyping and system emulation.

Several new and on-going SFF SoM open standards efforts are simplifying system design while addressing the need for next-gen performance. In this presentation, Samtec technical experts will update the latest SFF SoM open-standards efforts including UxV / 35™, VITA 93, SGeT HFM™ and PICMG® COM-HPC®

A Giant Leap for Interconnect: Next Gen VITA 100

With advances in silicon packages, there is a need to accommodate increased power consumption, higher pin counts and higher data rates while maintaining a smaller footprint. These requirements will be a challenge when implementing OpenVPX in next generation systems. In this presentation, we will discuss advances in interconnect for tomorrow’s embedded systems and preview the next generation connector – with increased pin count, data rates, and capacity – selected for VITA 100 architecture.